78 Series CleanTop® Breadboard
The Palomar Technologies 3880 Die Bonder is designed for fully automatic, precision microelectronics assembly. This flexible, computer-controlled die bonder and automated component placement system performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a large work area. See more Palomar Technologies product offerings at www.palomartechnologies.com
Photo courtesy of Palomar Technologies


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